1.开料：CutLamination/Material cutting

2.钻孔：Drilling

3.内钻：Inner LayerDrilling

4一次孔:Outer Layer Drilling

5.二次孔:2nd Drilling

6.雷射钻孔aser Drilling /Laser Ablation

7.盲(埋)孔钻孔:Blind & Buried Hole Drilling

8.干膜制程：PhotoProcess(D/F)/Dry Film

9.前处理(Pretreatment)

10.压膜ry Film Lamination

11.曝光:Exposure

12.显影eveloping

13.去膜:Stripping

14.压合：Lamination

15:黑化:Black OxideTreatment

16.微蚀:Microetching

17.铆钉组合:eyelet

18.迭板ay up

19.压合amination

20.后处理ost Treatment

21.黑氧化:Black Oxide Removal

22.铣靶:spot face

23.去溢胶:resin flush removal

24.减铜：Copper Reduction

25.水平电镀：HorizontalElectrolytic Plating

26.电镀：Panel plating

27.锡铅电镀:Tin-Lead Plating /Pattern Plating

28.低于1 mil: Less than 1 mil Thickness

29.高于1 mil:More than 1 mil Thickness

30.砂带研磨:Belt Sanding

31:剥锡铅:Tin-Lead Stripping

32.微切片: Microsection

33.蚀铜:Etching

34.初检:Touch-up

35.塞孔：Plug Hole

36.防焊(绿漆/绿油)：SolderMask

37.C面印刷rinting Top Side

38.S面印刷rinting Bottom Side

39.静电喷涂:Spray Coating

40.前处理retreatment

41.预烤recure

42.后烘烤ostcure

43.印刷:Ink Print

44.表面刷磨:Scrub

45.后烘烤ostcure

46.UV烘烤:UV Cure

47.文字印刷rinting of Legend

48.喷砂umice/Wet Blasting

49.印可剥离防焊/蓝胶eelable Solder Mask)

50.化学前处理,化学研磨：Chemical Milling

51.选择性浸金压膜：Selective Gold Dry Film Lamination

52.镀金：Gold plating

53.喷锡：Hot Air SolderLeveling

54.成型：Profile/Form

55.开短路测试：Electrical Testing

56.终检：Final VisualInspection

57.金手指镀镍金：Gold Finger

58.电镀软金：Soft Ni/Au Plating

59.浸镍金：Immersion Ni/Au / Electroless Ni/Au

60.喷锡:Hot Air Solder Leveling

61.水平喷锡:HorizontalHot Air Solder Leveling

62.垂直喷锡: Vertical Hot Air Solder Leveling

63.超级焊锡:Super Solder

64.印焊锡突点:Solder Bump

65.数控铣/锣板：N/C Routing/Milling

66.模具冲/啤板：Punch

67.板面清洗烘烤：Cleaning & Backing

68.V型槽/V-CUT：V-Cut/V-Scoring

69.金手指斜边：Beveling of G/F

70.短断路测试Electrical Testing/Continuity & Insulation Testing

71.AOI光学检查：AOI Inspection

72：VRS目检：Verified & Repaired

73.泛用型治具测试：Universal Tester

74.专用治具测试：Dedicated Tester

75.飞针测试：Flying Probe

76.终检：Final Visual Inspection

77.压板翘：Warpage Remove

78.X-OUT印刷：X-Out Marking

79.包装及出货：Packing& shipping

80.清洗及烘烤：Final Clean & Baking

81.铜面保护剂：ENTEK Cu-106A/OSP

82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test

83.冷热冲击试验:Thermal cycling Testing

84.焊锡性试验:Solderability Testing

85.雷射钻孔aser Ablation

86.雷射钻Tooling孔aser ablationTooling Hole

87.雷射曝光对位孔aser Ablation Registration Hole

88.雷射Mask制作aser Mask

89.雷射钻孔aser Ablation

90.AOI检查及VRS:AOI Inspection & Verified & Repaired

91.除胶渣esmear

92.专用治具测试edicated Tester

93.飞针测试:Flying Probe

94.压板翘: Warpage Remove

95.底片：Ablation

96.烧溶：laser)

97.切/磨：abrade

98.粗化：abrasion

99.耐磨性：absorption resistance

100.允收:ACC /accept

101.加速腐蚀:accelerated corrosion test

102加速试验:accelerated test

103.速化反应:acceleration

104.加速剂:accelerator

105.允许：acceptable

106.活化液：activator

107.实际在制品：active work in process

108.附着力：adhesion

109.黏着法：adhesive method

110.气泡:air inclusion

111.风刀：air knife

112.不定形的改变：amorphous change

113.总量：amount

114.硝基戊烷：amylnitrite

115.分析仪：analyzer

116环状垫圈;孔环annular ring

117.阳极泥：anodeslime (sludge)

118.阳极清洗：anodizing

119.自动光学检测：AOI/automatic optical inspection

120.引用之文件：applicable documents

121.允收水平抽样：AQL sampling

122.液态光阻：aqueous photoresist

123.纵横比(厚宽比)：aspect ratioAs received

124.背光：back lighting

125.垫板：back-up

126.预留在制品：banked work in process

127.基材：base material

128.基准绩效：baseline performance

129.批：batch

130.贝他射线照射法：beta backscattering

131.切斜边;斜边：beveling

132.二方向之变形:biaxial deformation

133.黑化：black-oxide

134.空板：blank panel

135.挖空:blanking

136.弹开:blip

137.气泡:blister blistering

138.吹孔:blow hole

139.板厚错误:board-thickness error

140.黏结层:bonding plies

141.板弯:bow ; bowing

142.破空:break out

143.搭桥;桥接：bridging

144.接单生产：BTO (Build To Order)

145,.烧焦：burning

146.毛边(毛头)：burr

147.碳化物：carbide

148.定位梢：carlson pin

149.载运剂：carrier

150.催化：catalyzing

151.阴极溅射法：catholicsputtering

152.隔板;钢板：caul plate

153.校验系统之各种要求：calibration system requirements

154.中心光束法：center beam method

155.集中式投射线：central projection

156.认证：certification

157.倒角(金手指)：chamfer chamfer

158.切斜边;倒角：chamfering

159.特性阻抗：characteristic impedance

160.电量传递过电压：charge transfer overpotential

161.网框：chase

162.棋盘：checkboard

163.蟹和剂：chelator

164.化学键：chemical bond

165.化学蒸着镀：chemical vapor deposition

166.圆周性之孔破：circumferential void

167.包夹金属：clad metal

168.无尘室：clean room

169.间隙：clearance

170.表面处理：Coating/Surface Finish

上即是pcb设计中专业英译术语之形状与尺寸